一、设备功能

　　适用于晶硅电池片显裂/隐裂、碎片、黑片、断栅、烧结网纹、污染等缺陷检测。

　　二、设备特点

　　红外成像相机，直射式拍摄

　　多规格组件适配

　　自动上电

　　流水信号对接

　　MES系统对接

　　三、设备技术参数

　　一、 Equipment functions

　　Suitable for the detection of obvious/hidden crack, fragment, black chip, broken grid, sintered mesh, contamination and other defects of crystal silicon cell.

　　二、equipment characteristics

　　Infrared imaging camera, direct shooting

　　Are suitable for multi-specification components

　　The fault is automatically powered on

　　Water signal docking

　　Are connected to the MES system