Denka TP-801 Transparent Resin Polymer (MBS resin) Polymethacrylate Butadiene Styrene

Styrene-Butadiene

Denka

产品说明：

"TX Polymer" (methyl methacrylate styrene), MS resins as an alternative to acrylic resins, with low density, low moisture absorption, and good moldability, "TH Polymer/TP Polymer," MBS resins with a good balance of transparency, strength and fluidity (methyl methacrylate butadiene styrene), "TE Series/CL Series," transparent ABS resins with excellent color attributes and tensile strength are available (among others).

Applications

TX is used for:

flat display substrates

optical components

miscellaneous goods.

TP/TH are used for:

food package sheeting as well as in manufacturing

electronic equipment and components

miscellaneous goods

TE/CL are for:

electronic equipment and components

information equipment components

AV equipment, etc.

物性信息：

物理性能额定值 (公制)额定值 (英制)测试方法

比重	1.10 g/cc	1.10 g/cc	ASTM D792
密度	1.086 g/cc	0.03923 lb/in³	ISO 1183
熔体流动速率	5.5 g/10 min @Load 5.00 kg, Temperature 200 °C	5.5 g/10 min @Load 11.0 lb, Temperature 392 °F	ISO 1133
	79 g/10 min @Load 10.0 kg, Temperature 220 °C	79 g/10 min @Load 22.0 lb, Temperature 428 °F	ISO 1133

机械性能额定值 (公制)额定值 (英制)测试方法

洛氏硬度（M 级）	34	34	ISO 2039-2
抗张强度(断裂)	35.0 MPa	5080 psi	50mm/min; ISO 527-2
	42.0 MPa	6090 psi	50mm/min; ASTM D638
伸长率 (断裂)	30 %	30 %	50mm/min; ISO 527-2
拉伸模量	4.70 GPa	682 ksi	50mm/min; ISO 527-1
弯曲强度	68.0 MPa	9860 psi	ISO 178
	69.0 MPa	10000 psi	2mm/min; ASTM D790
弯曲模量	2.18 GPa	316 ksi	2mm/min; ASTM D790
	2.20 GPa	319 ksi	2mm/min; ISO 178
Izod Impact Resistance	10.5 J/cm²	50.0 ft-lb/in²
简支梁缺口冲击强度	1.00 J/cm²	4.76 ft-lb/in²	ISO 179-2

热性能额定值 (公制)额定值 (英制)测试方法

载荷下热变形温度(1.8 MPa)	64.0 °C	147 °F	ISO 75-2
	72.0 °C	162 °F	ASTM D648
维卡软化温度	85.0 °C	185 °F	50N; ISO 306
可燃性(UL94)	HB	HB

光学性能额定值 (公制)额定值 (英制)测试方法

雾度	2.5 % @Thickness 2.00 mm	2.5 % @Thickness 0.0787 in	ISO 14782
Transmission, Visible	91 % @Thickness 2.00 mm	91 % @Thickness 0.0787 in	ISO 13468-1