紧凑宽温的GPU计算平台，支持nVidia ® GeForce® GTX 1050及6代Intel® 酷睿CPU
支持nVidia® GeForce® GTX1050及后续PASCAL GPU
专利导热设计，系统工作温度可支持-25°C到60°C宽温
支持Intel® 6代Skylake i7 / i5 LGA1151 CPU
6个千兆以太网口，支持9.5k巨帧
结构紧凑，外观尺寸仅240mm x 225mm x 111mm
提供MezIO™ 接口，易于扩展各种功能接口
可接连两颗2.5" SATA硬盘/固态盘(SSD)，支持RAID 0/1
| Supports 6th-Gen Intel® 酷睿™ LGA1151 CPU - Intel® 酷睿™ i7-6700 (8M Cache,3.4/4.0 GHz, 65W TDP) - Intel® 酷睿™ i5-6500 (6M Cache, 3.2/3.6 GHz, 65W TDP) - Intel® 酷睿™ i7-6700TE (8M Cache, 2.4/3.4 GHz, 35W TDP) - Intel® 酷睿™ i5-6500TE (6M Cache, 2.3/3.3 GHz, 35W TDP) |
| Intel® Q170 Platform Controller Hub |
| NVIDIA® GeForce® GTX 1050* GPU (75W TDP), or Integrated Intel® HD 530/510 Controller |
| 兩个SODIMM内存插槽,最高可支持 32 GB DDR4-2133 SDRAM |
| Supports AMT 11.0 |
| Supports TPM 2.0 |
| 6x Gigabit Ethernet ports by Intel® I219 and 5x I210 |
| 1x DB-15 connector for analog RGB, supporting 2048x1536 resolution 2x DVI-D connectors for DVI/HDMI outputs, supporting 1920x1080 resolution (Supporting dual independent display outputs) |
| 4x USB 3.0 ports via native XHCI controller 4x USB 2.0 ports |
| 1x stacked VGA + DVI-D connector 2x DisplayPort connectors, supporting 4K2K resolution |
| 2路RS-232/422/485串口(COM1 & COM2)，可由BIOS设置 1路RS-232串口(COM3) |
| 1路扬声器输出和1路麦克风输入 |
| 内置2个SATA接口，可接2.5"硬盘/SSD, 支持 RAID 0/1 |
| 1个全长mSATA口 (mux with mini-PCIe) |
| 1x internal mini PCI Express socket with front-accessible SIM socket 1x internal mini PCI Express socket with internal SIM socket (mux with mSATA) |
| 1x MezIO™ expansion port for Neousys’ MezIO™ modules |
| 3芯插拔式端子排，供8~35V直流输入 |
| 1x 10-pin (2x5) wafer connector for remote on/off control and status LED output |
| 240毫米(宽) x 225毫米(深) x 111毫米(高) |
| 4.8 kg (incl. CPU, GPU, memory and HDD) |
| Wall-mount by mounting bracket |
| with i7-6700TE, i5-6500TE (35W TDP) -25°C ~ 60°C ** with i7-6700, i5-6500, i3-6100 (65W/51W TDP) -25°C ~ 60°C **/*** (configured as 35W CPU mode) -25°C ~ 50°C **/*** (configured as 65W/51W CPU mode) |
| -40°C ~ 85°C |
| 10%~90% , 无凝露 |
| 运行状态, 5 Grms, 5-500 Hz, 3 轴 (采用SSD, 测试标准采用IEC60068-2-64) |
| 运行状态, 50 Grms, 半正弦曲线 11 毫秒时长 (采用SSD, 测试标准采用 IEC60068-2-27) |
| CE/FCC Class A, 测试标准采用 EN 55022 及 EN 55024 |
*The CPU loading is applied using Intel® Thermal Analysis Tool. For detail testing criteria, please contact Neousys Technology.
**For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required..